请问是否有适合VoIP电话项目的，容量为512M的DDR1的存储芯片产品？

64M*8 2.5V 66pin TSOP II

256M-A die - 5+ years 16M x 16 3.3V 143Mhz Commercial (0 ~ 70°C) 54pin TSOP II

256M A die,16M x 16,3.3V,143Mhz,Commercial (0 ~ 70°C),54ball FBGA

512M 16M x 3

32M x 16 1.8V 84ball FBGA

64M x 16 1.8V 400MHz 800Mbps/pin Commercial (-0 ~ 85°C) 84ball FBGA

128M - A die - 5+ years 63nm 8M x 16 3.3V 143MHz Commercial (0 ~ 70°C) 54pin TSOP II

128M x 8 1.8V 400MHz 800Mbps/pin Commercial (-0 ~ 85°C) 60ball FBGA

64M x 16 1.8V 400MHz 800Mbps/pin Industrial (-40 ~ 95°C) 84ball FBGA

64M x 16 1.8V 166MHz 333Mbps/pin Industrial-40°C to 85°C 60-ball FPBGA

16M x 16,3.3V,54pin TSOP II

64M x 16 1.8V 400MHz 800Mbps/pin Commercial (-0 ~ 85°C) 84ball FBGA

512M - A Die 32M x 16 3.3V 143MHz Commercial (0 ~ 70°C) 54pin TSOP II

512M 32M x 16 1.8V 400MHz

Synchronous DRAM

4M x 16,3.3V,54pin TSOP II

64M x16,1.8V, 400MHz, 800Mbps/pin,Commercial (-0 ~ 85°C),84ball FBGA

4Gbit 256M x 16 1.5V 800MHz DDR3-1600bps/pin

Synchronous DRAM

64M - no die change 2M x 32 3.3V 166MHz Industrial (-40 ~ 85°C) 90ball TFBGA

Synchronous DRAM

256M 8M x 32 3.3V 143Mhz Commercial (0 ~ 70°C) 90 ball TFBGA

Synchronous DRAM

DDR3

AS4C系列

2G New B die 128M x 16 1.35V 800MHz DDR3-1600bps/pin Commercial (Extended) (0 ~ 95°C) 96-ball FBGA

96ball FBGA

Synchronous DRAM

84-ball 8 x 12.5 x 1.2mm (max) FBGA package

512M - B Die New 32M x 16 3.3V 143MHz Industrial (-40 ~ 85°C) 54pin TSOP II

8M x 16,3.3V,54pin TSOP II

"1M x 16 3.3V 166MHz Commercial (0 ~ 70°C) 50pin TSOP II　"

commercial 32M x 16