在大、中型PLC/CTH3变频器项目中，操作系统的存储采用DDR2，容量需求达到1G，运行速度为400MHZ，封装为FBGA，是否有合适的DDR2存储芯片？

64M x 16 1.8V 400MHz 800Mbps/pin Commercial (-0 ~ 85°C) 84ball FBGA

256M-A die - 5+ years 16M x 16 3.3V 143Mhz Commercial (0 ~ 70°C) 54pin TSOP II

128M - A die - 5+ years 63nm 8M x 16 3.3V 166Mhz Industrial (-40 ~ 85°C) 54pin TSOP II

32M x 16 1.8V 84ball FBGA

256M A die,16M x 16,3.3V,143Mhz,Commercial (0 ~ 70°C),54ball FBGA

64M x 16 1.8V 400MHz 800Mbps/pin Commercial (-0 ~ 85°C) 84ball FBGA

64M x16,1.8V, 400MHz, 800Mbps/pin,Commercial (-0 ~ 85°C),84ball FBGA

64M*8 2.5V 66pin TSOP II

AS4C16M16SA系列

256M-A die - 5+ years;16M x 16;166Mhz

128M - A die - 5+ years 63nm 8M x 16 3.3V 143MHz Commercial (0 ~ 70°C) 54pin TSOP II

128M x 8 1.8V 400MHz 800Mbps/pin Commercial (-0 ~ 85°C) 60ball FBGA

64M x 16 1.8V 400MHz 800Mbps/pin Industrial (-40 ~ 95°C) 84ball FBGA

32M x 16 bit DDR3L Synchronous DRAM (SDRAM)

AS4C32M16D3L系列

32M x 16 bit DDR3L Synchronous DRAM (SDRAM)

96-ball FBGA

64M x 16 1.8V 166MHz 333Mbps/pin Industrial-40°C to 85°C 60-ball FPBGA

16M x 16,3.3V,54pin TSOP II

512M - A Die 32M x 16 3.3V 143MHz Commercial (0 ~ 70°C) 54pin TSOP II

Synchronous DRAM

64M x 16 bit DDR3L Synchronous DRAM (SDRAM)

AS4C64M16D3LB系列

64M x 16 1.35V 800MHz DDR3-1600bps/pin Industrial (-40 ~ 95°C) 96-ball FBGA

96ball FBGA

4M x 16,3.3V,54pin TSOP II

DDR3

AS4C系列

2G New B die 128M x 16 1.35V 800MHz DDR3-1600bps/pin Commercial (Extended) (0 ~ 95°C) 96-ball FBGA

96ball FBGA

4Gbit 256M x 16 1.5V 800MHz DDR3-1600bps/pin

64M - no die change 2M x 32 3.3V 166MHz Industrial (-40 ~ 85°C) 90ball TFBGA

256M 8M x 32 3.3V 143Mhz Commercial (0 ~ 70°C) 90 ball TFBGA

64M x 16 bit DDR3 Synchronous DRAM (SDRAM)

AS4C64M16D3B系列

"1Gb 64M x 16 Commercial 0°C to 95°C 96-ball FBGA"

96ball FBGA

Synchronous DRAM

Synchronous DRAM

84-ball 8 x 12.5 x 1.2mm (max) FBGA package

Synchronous DRAM

8M x 16,3.3V,54pin TSOP II

8Gbit DDR3L SDRAM

AS4C1G8D3LA系列

8Gbit DDR3L SDRAM

78ball FBGA